Capability Roadmap
Traditional PCB - 1
  | 2020 Standard | 2020 Advanced | 2021 | 2022 | |
Line Width/Space(um): | 50/50 | 40/40 | 40/40 | 35/35 | |
| Pattern Position Tolerance(um): | +/-30 | +/-25 | +/-25 | +/-20 | |
| Impedance Tolerance: | +/-8% | +/-5% | +/-5% | +/-4% | |
Maximum Layer Count: (Traditional & HDI) | 26L | 30L | 30L | 36L | |
Routing Tolerance: (um) | +/-75 | +/-50 | +/-50 | +/-35 | |
Finished Board Thickness: (mm) | 0.2~3.5 | 0.15~4.0 | 0.15~4.0 | 0.1~4.0 | |
Board Thickness Tolerance (mm) | Thickness > 0.5mm: | +/-10% | +/-8% | +/-8% | +/-6% |
Thickness ≤ 0.5mm: | +/-0.05 | +/-0.03 | +/-0.03 | +/-0.03 | |
Traditional PCB - 2
  | 2020 Standard | 2020 Advanced | 2021 | 2022 | |
| Min. Mechanical Drill Size(um): | 100 | 75 | 75 | 75 | |
| Hole To Hole Accuracy(um): | +/-50 | +/-50 | +/-50 | +/-38 | |
Max. Aspect Ratio (Through-hole): | 0.1≤ Dia. < 0.2mm: | 6:1 | 8:1 | 8:1 | 10:1 |
0.2≤ Dia.< 0.3mm: | 10:1 | 12:1 | 16:1 | 18:1 | |
0.3mm ≤ Dia.: | 11:1 | 15:1 | 18:1 | 20:1 | |
Through Hole Size Tolerance (um): | NPTH: | +/-50 | +/-25 | +/-38 | +/-25 |
| PTH: | +/-75 | +/-50 | +/-50 | +/-38 | |
| Press Fit Hole: | +/-50 | +/-38 | +/-38 | +/-38 | |
Mechanical Blind Hole: | Min. Hole Size: (um) | 200 | 150 | 150 | 100 |
Hole Size Tolerance: (um) | +/-75 | +/-50 | +/-50 | +/-38 | |
Depth Precision: (um) | +/-50 | +/-25 | +/-38 | +/-25 | |
| Max. Aspect Ratio: | 0.8:1 | 1:1 | 0.9:1 | 1:1 | |
HDI
  | 2020 Standard | 2020 Advanced | 2021 | 2022 |
| Maximum Layer count of Any-layer: | 14L | 16L | 16L | 18L |
Minimum Blind via size(mm): | 0.075 | 0.075 | 0.075 | 0.075 |
| Max Blind Via Aspect Ratio: | 0.7:1 | 0.8:1 | 0.8:1 | 1:1 |
| Min Blind via Capture pad(mm): | Dia.+0.15 | Dia.+0.1 | Dia.+0.13 | Dia.+0.1 |
| Min Blind via Target Pad(mm): | Dia.+0.15 | Dia.+0.1 | Dia.+0.13 | Dia.+0.1 |
Filling via dimple value(um): | ≤15 | ≤10 | ≤10 | ≤10 |
Maximum lamination times: | 6 | 7 | 7 | 8 |
Rigid-flex1
| Item | Flex - Rigid | Regal | Semi-Flex |
| Figure |   |   |   |
| Flexible Material | Polyimide | FR4 + Coverlay (Polyimide) | FR4 |
| Flexible thickness | 0.025~0.1mm (Exclude copper) | 0.05~0.1mm (Exclude copper) | Remained Thickness: 0.25+/-0.05mm (Dedicated Material: EM825(I)) |
| Bending angle | Max 180° | Max 180° | Max 180° (Flex layer≤2) Max 90° (Flex layer>2) |
Flexural Endurance IPC-TM-650, Method 2.4.3. | <1000 cycle | < 25 cycle | NA |
Bending Test 1) Mandrel diam: 6.25mm | <10K cycle (Bending Angle:180°) | <500 cycle (Bending Angle:180°) | <10 cycle (Bending Angle:180°) |
Application | Flex to install & Dynamic(Single side) | Flex to install | Flex to install |
Rigid-flex2
  | 2020 Standard | 2020 Advanced | 2021 | 2022 |
Line Width/Space on Flex Core(um): | 60/60 | 50/50 | 50/50 | 40/40 |
Impedance Tolerance on Flex Layer: | +/-8% | +/-5% | +/-5% | +/-4% |
| Flex Core Thickness (Exclude copper) (um): | 25 | 25 | 20 | 12.5 |
| Maximum Flex Layer Count: | 6L | 8L | 8L | 8L |
| Flex outline tolerance(um): | +/-100 | +/-50 | +/-75 | +/-50 |
| Flex outline to Pattern tolerance (um): | ±100 | ±50 | ±75 | ±50 |
| Finished Flex Board Thickness (mm): | 0.075~0.25 | 0.075~0.3 | 0.075~0.3 | 0.075~0.3 |
苏公网安备 32020502000950号
